RWS Wafer Robot

FEATURES

  • The advantage is on vertical integration of bothhardware and software, also using high precisionand stiffness DD motor, the repeatability can reach±0.1mm. Small circling radial and high utilizationof space.
  • Various options for end effectors such as vacuumtype, gripping type and flipping type. Able to providetotal solution to adapt to all kinds of customerapplications.

APPLICATIONS

Pick–and–place equipment inSemiconductor industry(pick-and place of wafer), Optoelectronics(mini panel, mini solar panel) and LED industry(sapphire substrate, rubber ring).

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