ballscrew

RWD Wafer Robot

FEATURES

  1. The advantage is on vertical integration of bothhardware and software, also using high precisionand stiffness DD motor, the repeatability can reach±0.1mm. Small circling radial and high utilizationof space.
  2. Various options for end effectors such as vacuumtype, gripping type and flipping type. Able to providetotal solution to adapt to all kinds of customerapplications.

APPLICATION

Pick-and-place equipment in Semiconductor industry(pick-and-place of wafer), Optoelectronics(mini panel, mini solar panel) and LED industry(sapphire substrate, rubber ring).

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