- HPA series is a three axis controlled wafer aligner, utilizing HIWIN miniature single axis robot module providing advantages of high speed, high precision and high efficiency in compact size.
- Controller inbuilt (All-in-one design), does not need controller setup or cable space. Most compact design under same specifications.
- Equipped with intelligent through beam laser sensors, supporting contour detection function of transparent, translucent and opaque objects and suitable for diameters of 100~300mm
- Cleanliness level of the product is ISO Class 3 (Class 1), suitable for applications including semiconductor and opto-electronics.
It is suitable for the alignment of semiconductor industry (wafer), LED industry (sapphire substrate), optoelectronic industry (glass), etc.